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BCM Advanced Research
Delivering Quality Intelligent Computing Systems |
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BCM Broadwell COM-E Module: ESM-BDW SoC solution is available now!
Equipped with onboard 5th Generation Intel® Core™ Mobile U-Processor, ideal for low power, portability, and space constrained industrial applications
BCM's ESM-BDW COM Express module is a small but powerful platform based on Intel's 5th generation 14nm Intel® Core™ Broadwell SoC Mobile U-Processor series packing high performance with low thermal design power (TDP). The main features include high performance using 5th generation Core technology, ultra-low power at 15 watts TDP configurable down to 9.5 watts, HD graphics, high quality sound, all in the Compact COM-E 95x95mm small form factor ideal for space-constrained and embedded portable solutions.
COM Express modules require a compatible carrier board to support the custom I/O expansion requirements of the target system. This form factor is an ideal solution for embedded applications that are looking for a stable I/O platform to fit a pre-defined mechanical envelop (carrier board) but with a performance / technology upgrade path on the core logic part of the system (COM-E module). This setup allows for the benefits of design stability offered through a fixed carrier board plus addresses the need to stay current on technology through a modular upgrade path for the CPU and chipset by upgrading the COM Express module. The benefits are many including saving development costs, reducing obsolescence risk, and speeding time-to-market migration. Such applications include signal test & measurement, sophisticated medical devices, gaming systems with complex I/O and cable harnesses, or systems with multiple I/O options that share a common core technology and operating system.
ESM-BDW COM-E module supports the next generation of Internet of Things solutions while maintaining compatibility with previous COM-E generations. This platform enables a high-quality user experiences with devices that are small, low power, thermally efficient, manageable, and secure.
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ESM-BDW Brief Specifications |
A low power, small form factor COM Express module built with 5th generation Intel Broadwell SoC solution
- Onboard 5th Gen Intel® Core™ SoC i7/i5/i3 BGA Processor
- 2 x 204-pin DDR3L SODIMM up to 8G per DIMM
- Support Dual Channel LVDS, Display Port, HDMI, VGA, eDP(optional)
- 4 SATA (6.0GB/s), 8 USB 2.0, 2 USB 3.0, 8-bit GPIO
- Intel 1218LM Gigabit Ethernet
- Type 6 Pin-out
ESM-BDW SKUs
Model Name |
Onboard Processors |
ESM-BDW-5650 |
Intel Core i7-5650U CPU, 4M Cache, up to 3.20 GHz |
ESM-BDW-5650 |
Intel Core i5-5350U CPU, 3M Cache, up to 2.90 GHz |
ESM-BDW-5010 |
Intel Core I3-5010U CPU, 3M Cache, up to 2.10 GHz |
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Availability
In stock! Available now! Please contact your authorized BCM distributors for pricing and delivery or for additional information please email BCMSales@bcmcom.com
* All product specifications and product images are subject to change without notice. |
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Custom Design
BCM Specializes in custom design for industrial motherboards and long life embedded computing systems. We are capable of providing turn-key customized carrier boards supporting our COM-E modules to meet your project and deadline requirements benefiting our customers with lower total cost of ownership, low volume manufacturing, and fast time-to-market production. BCM has project teams in both North America and Asia to support our custom designs. Please contact BCMSales@bcmcom.com for more information regarding BCM custom design services or visit our website at http://www.bcmcom.com/custom_motherboard_design.htm for more information. |
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Related Products
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ESM-BSW |
Intel Braswell Celeron N3000 Series SoC Processor Family COMe Type6 Module
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ESM-BYT |
Intel BayTrail Atom E3000/ Celeron J1900 Series SoC Processor Family COMe Type 6 Module
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ESM-QM87 |
Intel Haswell Core i7/i5/i3 Processors COMe Type 6 Module with Intel QM87 Chipset
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ESM-QM77 |
Intel Ivy Bridge Core i7/ i5/ i3 Processors COMe Type 6 Module with Intel QM77 Chipset
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© BCM Advanced Research, 11 Chrysler, Irvine, California, USA. All Rights Reserved.
BCM Advanced Research (BCM) is a leading developer and manufacturer of x86/ARM RISC embedded industrial motherboards and systems for ODMs and OEM that integrate computing technology into their products. We own a very strong R&D engineering team and operation department based in Southern California in order to provide prompt project develop support and instant problem solving assistance.
We can be reached by email BCMSales@bcmcom.com. To unsubscribe from this e-mail list, reply to this e-mail with "unsubscribe" in the subject line or Click here to unsubscribe. |
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